Maskless Lithography: Nikon DSP-110 Speeds Chip Packaging

Maskless lithography is getting faster. Nikon Corporation says it will release the DSP-110, a digital lithography system for semiconductor advanced packaging, in April 2027. According to Nikon’s announcement from Tokyo, the new machine offers 1.5 µm resolution, supports large substrates and delivers about 40% higher throughput than its predecessor, the DSP-100. Like the earlier model, it draws circuit patterns without needing photomasks.

That may sound like a niche update. But advanced packaging, the step where chips are joined and wired together, has become one of the busiest corners of the AI hardware boom.

Why maskless lithography matters for chip packaging

According to Nikon, demand is growing for redistribution layer (RDL) patterning, the fine wiring that routes signals across a package. This is driven by the need for high-density wiring on large interposers and multilayer FC-BGA substrates. FC-BGA (Flip Chip-Ball Grid Array) is a high-density package substrate that lets large chips run faster and do more.

Traditional lithography uses a photomask, a stencil carrying the circuit pattern. Nikon says its digital lithography systems remove the need for those masks while aiming for both high resolution and high productivity.

What the DSP-110 offers

Nikon lists three main features:

• Higher throughput. By redesigning the optical system for 1.5 µm line and space (L/S) resolution, Nikon says throughput rises by about 40% over the DSP-100. The DSP-110 can process 72 panels per hour on 510 × 515 mm substrates, while keeping overlay accuracy within ±0.3 µm.
• A wider focus margin. The redesign also widens the focus margin, the tolerance within which circuit dimensions stay accurate even if the focal point shifts. Nikon says this supports stable patterning across varied substrate conditions, which should help yield.
• An upgrade path. The DSP-110 can be upgraded to 1.0 µm L/S resolution by replacing its optical system.

Supported square substrates include 310 × 310 mm, 510 × 515 mm, 600 × 600 mm and 730 × 920 mm sizes. Nikon credits the improvements to its in-house ability to design and make optical systems.

The trade-off: speed versus resolution

There is a catch worth noting. The DSP-100 already offers finer 1.0 µm resolution. The DSP-110 gains its speed partly by working at 1.5 µm. So it is not a straight replacement for every job. It suits customers whose layers can work at 1.5 µm and who want more panels per hour. Those needing finer lines will have to pay for the optical upgrade or stay with the older model.

Some questions remain open. Nikon has not shared pricing, named customers or independent test data, and all performance figures come from the company. The machine also does not ship until April 2027, and Nikon notes its information may change without notice.

Where this fits in the bigger picture

Packaging is now a key bottleneck in building AI chips, and many tool makers are racing to serve it. The DSP-110 is one more sign that the industry sees money in faster, more flexible packaging tools. If you follow this space, you may also like our stories on the FormFactor and Teradyne chip testing deal and on how Atomic Machines raised $250M for its matter compiler.

From a security angle, there is no direct risk in a lithography tool itself. Still, as packaging supply chains grow more complex, chipmakers will want clear assurance about who builds and services these machines and how production data is handled.

My view on maskless lithography

As a writer, I feel this is a practical, unflashy upgrade that matters more than it looks. A 40% jump in throughput can shift the economics of a packaging line, and skipping photomasks gives makers more flexibility as designs change. I like that Nikon built in an upgrade path instead of forcing a new purchase. But these are claims on paper for now. I’d want to see real customer results after the April 2027 launch before calling it a win.

FAQ: maskless lithography and the Nikon DSP-110

What is the Nikon DSP-110?

It is a digital lithography system for semiconductor advanced packaging that patterns circuits without photomasks, with 1.5 µm line and space resolution.

When will the DSP-110 be released?

Nikon says it will be released in April 2027.

How much faster is the DSP-110?

Nikon says it has about 40% higher throughput than the DSP-100, reaching 72 panels per hour on 510 × 515 mm substrates.